Thermal and Reliability Optimization of Resistors for MCM
نویسندگان
چکیده
An approach for thermal simulation and reliability evaluation of MCM film resistors is described. Result can be used to reach an optimal solution based on available data, technology, topology and material parameters. To achieve a high reliability level and performance of the resistors, the board must be designed taking into account the thermal consideration for each component. Result of thermal simulation and experimental measurements gives an error less than 5%. Key-Words: Thermal simulation, Reliability, MCM, Hybrid circuits, Thin/Thick film resistors, Optimization
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